Parts Name: Plastic Molding joint
Material: ABS
Applications: Used for automotive sensors, smart wearable devices, IoT modules, and custom electronic connection solutions
Features: High-precision circuit integration, excellent electrical conductivity, high temperature resistance, corrosion resistance, lightweight design, 3D circuit molding capability, stable signal transmission
Tolerance: ±0.1mm
3D Circuit Integration Capability: The LDS process enables direct circuit patterning on complex 3D plastic surfaces, eliminating the need for traditional wiring and PCB assembly, significantly reducing component volume and weight.
High Design Flexibility: Supports customized circuit layouts and rapid prototyping, making it ideal for small-batch, high-customization electronic products and iterative R&D projects.
Superior Mechanical Strength: The LDS-grade engineering plastic base provides excellent impact resistance and structural stability, ensuring long-term reliability in harsh automotive and industrial environments.
Excellent Adhesion & Durability: The gold-plated conductive circuit has strong adhesion to the plastic substrate, with outstanding resistance to peeling, vibration, and thermal shock, extending product service life.
High Precision & Miniaturization: Achieves ultra-fine circuit line widths and spacing, enabling miniaturization of electronic components while maintaining high signal transmission accuracy.
Cost-Effective Mass Production: The one-step molding process simplifies the production chain, reduces manual assembly steps, and lowers overall manufacturing costs for mass production.
Environmental Compatibility: Complies with RoHS environmental standards, free of harmful substances, and meets the requirements of green electronic manufacturing.
Multi-Functional Integration: Can integrate circuit, structural support, and connector functions in a single component, simplifying product design and improving system integration.
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No.33,Lijiacao Industrial Park,Chengyang District,Qingdao,Shandong,China. 266109
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